Orbray and Mirise to collaborate on diamond power chips
Japanese duo to develop tech needed for more efficient future EVs
Japanese jewel-processing company Orbray and Mirise Technologies, an automative research firm established in 2020 by Denso and Toyota, have begun collaborating on vertical diamond power devices.
Over the three-year period of this project, Orbray and Mirise Technologies will use their respective technologies, resources, and expertise in diamond substrates and power devices to develop the technologies needed to deploy vertical diamond power devices in a wide range of future electric vehicles.
Orbray will be responsible for developing a p-type conductive diamond substrate, while Mirise Technologies will take charge of developing a high-voltage operating device structure to demonstrate the feasibility of a vertical diamond power device.
Compared with current mainstream semiconductor materials such as silicon, SiC and GaN, diamond is sometimes called the 'ultimate semiconductor material' because it has higher voltage operating capability and superior thermal conductivity (heat dissipation).
The development and mass production of next-generation automotive semiconductors using diamond is expected to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs.