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Denso and USJC ship first automotive IGBTs


Companies announce first 300mm-based IGBTs from strategic partnership

Denso Corporation and United Semiconductor Japan Company (USJC), a subsidiary of the foundry UMC, have announced the start of mass production of IGBTs at USJC's 300mm fab. This comes one year after the companies announced a strategic partnership for IGBTs used in electric vehicles.

The jointly invested line at USJC supports the production of a new generation of IGBT developed by Denso, which is said to offer 20 percent reduction in power losses compared with earlier generation devices. Production is expected to reach 10,000 wafers per month by 2025.

“USJC is proud to be the first semiconductor foundry in Japan to manufacture IGBT on 300mm wafers, offering customers greater production efficiency than the standard fabrication on 200mm wafers. Thanks to our dedicated teams and support from Denso, we were able to complete trial production and reliability testing without delay and honour the mass production date as agreed with the customer,” said Michiari Kawano, president of USJC.

Pictured above: from left, Denso president Koji Arima, UMC co-president Jason Wang

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