Infineon and Schweizer to embed SiC chips into PCBs
Collaboration aims to take automotive power electronics to the next level
Infineon Technologies and Schweizer Electronic, a PCB company, are developing a solution to embed Infineon’s 1200 V CoolSiC chips directly onto printed circuit boards (PCB). They say this will increase the range of electric vehicles and reduce the total system costs.
The companies have already demonstrated the potential of this new approach: They were able to embed a 48 V MOSFET in a PCB. This resulted in a 35 percent increase in performance. Schweizer contributes to this success with its p²Pack solution which enables power semiconductors to be embedded in PCBs.
“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, product line head automotive high-voltage discretes and chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200 V CoolSiC devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”
“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, VP technology at Schweizer Electronic AG. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”
Infineon and Schweizer will show the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, Germany
