Ventec introduces new thermal laminate for power modules
Latest high thermal conductive metal base laminate is designed for high performance power applications
Ventec has launched what is says is its latest high thermal conductive metal base laminate VT-4BC designed for use in applications requiring high performance in thermal management including super bright lighting, IGBTs, power modules, controllers, motor drives and rectifiers.
With high electrical breakdown strength, VT-4BC is designed to provide high reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.
In addition, VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is also resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.
Ventec’s Global Head IMS Technology, Chris Hanson commented on the release of VT-4BC: “We are proud to introduce a product that provides unparalleled thermal performance and highest electrical breakdown strength. VT-4BC is designed for customers who value reliability and require improved performance over traditional materials. We look forward to showcasing it at IPC APEX Expo in January, where attendees can discover its superior capabilities firsthand.”
The material will make its US debut at IPC APEX Expo 2023 from 24-26 January in San Diego.