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Mitsubishi to launch SLIMDIP-Z power module


High rated current of 30A will help to simplify and downsize inverter systems in appliances

Mitsubishi Electric has announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.

The compact module will enable the SLIMDIP series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines and refrigerators.

In 1997, Mitsubishi Electric commercialised its first DIPIPM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy-efficiency of inverter boards.

Features include an optimised frame shape that expands the reverse conducting IGBT (RC-IGBT) chip’s mounting area; and an insulation sheet that reduces thermal resistance between chip junction and case by about 40 percent compared to existing SLIMDIP-L.

RC-IGBT temperature suppression will help to simplify and downsize the thermal designs of inverter systems, according to Mitsubishi.

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