Infineon and Stellantis sign multi-year SiC deal
Potential sourcing volume and capacity reservation have a value of significantly more than €1 billion
Infineon and the Netherlands-based automotive giant Stellantis have signed a non-binding MoU as a first step towards a potential multi-year supply cooperation for SiC semiconductors.
Infineon would reserve manufacturing capacity and supply CoolSiC 'bare die' chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion.
“We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life,” said Peter Schiefer (pictured above), division president Automotive of Infineon.
“Compared to traditional power technologies, SiC increases the range, efficiency and performance of electric vehicles. With our leading CoolSiC technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility.”
Infineon and Stellantis are in talks about delivering the CoolSiC Gen2p 1200 V and CoolSiC Gen2p 750 V chips for electric vehicles under Stellantis brands. The performance, reliability, and quality of CoolSiC technology would allow Stellantis to build vehicles with longer ranges and lower consumption for the best user experience – and support the company in its efforts to standardise, simplify and modernise platforms.
Infineon is preparing for the accelerated demand of the industry with significant investments. In 2024 Infineon’s new fab for SiC technologies will start manufacturing in Kulim, Malaysia. It will complement existing manufacturing capacities in Villach, Austria, following Infineon’s multi-site strategy.