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ALD TechDay for More-than-Moore devices


Yole, CEA-Leti, and Beneq Oy are hosting a seminar: ALD TechDay Forum for More-than-Moore devices. This half-day event will be held in Munich, Germany, on Nov. 15 beginning at 15:00.

Attendees will hear presentations on Atomic layer deposition (ALD) equipment for More-than-Moore devices. Critical ALD solutions for More-than-Moore device challenges and Gate dielectric challenges associated with the fabrication of GaN MOS-channel HEMT power transistors.

Why is it important?
Yole estimates that by 2026, ALD equipment sales for More-than-Moore devices will grow by 12% per year to $680 million. Who is adopting ALD and for what applications?

Who is it for?
More-than-Moore semiconductor IDM's, foundries, and research and technology organizations.

Device markets
Power, RF, CMOS image sensor, optoelectronics and photonics devices, MEMS sensors and actuators, advanced packaging, and µOLED fabs and IDMs.

Due to high demand and limited capacity, please kindly let us know if you would like to reserve a free seat below.


Speakers and topics

Gate dielectric challenges associated with the fabrication of GaN MOS-channel HEMT power transistors

Véronique Sousa, Ph.D., is the Head of Laboratory for Power Semiconductor Devices at CEA-Leti and was Project Manager for Power Semiconductor Devices at CEA-Leti from 2019-2020. She has 20 years of experience leading R&D projects dedicated to the optimization of different resistive memory technologies. Since 2018, her work focus has shifted towards GaN power devices. In addition to her experience at CEA-Leti, Véronique has worked at GlobalFoundries (GF) as an R&D Engineer for CMOS integration and at INESC-MN (Lisbon, Portugal) as a Postdoctoral Research Fellow for magnetic thin films.

Critical ALD solutions for More-than-Moore device challenges
Patrick Rabinzohn, Ph.D., is the Strategic Development Executive for the Beneq Oy Semiconductor Business and was VP for the Semiconductor Business from 2019 to 2022. He has 40 years of industry experience across the semiconductor R&D, device manufacturing, equipment and materials markets and has extensive knowledge of equipment, process integration and technologies. Prior to joining Beneq, Patrick held several high-profile roles, including CTO for IoT/MEMS and Advanced Packaging at Lam Research, General Manager at Intermolecular, Managing Director for Microelectronics at Alchimer, and CTO Europe at Applied Materials.

Atomic layer deposition (ALD) equipment for More-than-Moore devices
Taguhi Yeghoyan, Ph.D., is a Technology & Market Analyst, Semiconductor Manufacturing at Yole Intelligence, part of Yole Group, within the Semiconductor, Memory & Computing division. Taguhi's mission is to follow daily the semiconductor industry and its evolution. Based on her expertise in this field, especially in the semiconductor supply chain (processes, materials, equipment, and related applications), Taguhi performs technology & market reports and is engaged in relevant custom projects. Prior to Yole, she worked in world-class European research centers and laboratories, including imec (Belgium), LMI (Lyon, France) and LTM at CEA Leti (Grenoble, France). All along her past experiences, Taguhi has authored or co-authored two patents and more than ten papers. She has graduated from Wroclaw University of Technology (Poland) and University of Lyon (France). Taguhi also completed her PhD. in Material Science from the University of Lyon (France).

Power Electronics International to return to Brussels – Inaugral event.

The first power electronics conference and exhibition will bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face on 18-19 April 2023

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: CS International and PIC International.
  • Email info@pe-international.net  or call +44 (0)24 7671 8970 for more details.


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