UTAC announces copper clip packaging for discrete MOSFETs
Provides better electrical performance compared with wire bond packages
UTAC Holdings, a semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging solution for power MOSFET market.
UTAC says that the copper clip technology not only provides better electrical performance compared with wire bond packages but also provides enhanced thermal path within the package, ensuring that the MOSFET runs cooler, thereby enhancing reliability and enabling greater power densities. The compact MOSFET Cu clip maintains the common package industry footprint of 5 x 6 mm.
John Nelson, president and CEO, UTAC comments, “Packaging of discrete devices plays a key role in the performance of power solutions. Our new discrete Cu clip line will provide a cost effective solution for our customers.”
He continued “Alongside this we are setting up thin wafer handling (down to 2 mil) for PQFN56 packages and we intend to develop a 10 mil Cu clip for this technology to support further advances.”
