Infineon Announces Highest Density IGBT Modules
EconoDUAL3 modules with TRENCHSTOP 1700V IGBT7 enable highest power densities
Infineon Technologies has launched the new TRENCHSTOP 1700 V IGBT7 chip in the standard industrial package EconoDUAL 3. With this new chip technology, the EconoDUAL 3 is said to provide a leading current of 900 A and 750 A, and enables an improved power range for inverters. The modules target a wide range of applications including wind, drive and static VAR generators (SVG).
Compared to modules with the previous IGBT4 chipset, the FF900R17ME7_B11 with the TRENCHSTOP IGBT7 chip enables up to 40 percent higher inverter output current in the same package size. The new 1700 V IGBT7 modules also feature significantly lower static and dynamic losses while addressing applications with prevailing static losses in diode chips. In addition, the new chip technology offers enhanced du/dt controllability and improved diode softness. Induced by cosmic rays, the FIT rate has also been significantly improved - an important parameter when working with high DC link voltage. Furthermore, the new power modules feature a maximum overload junction temperature of 175°C.
In addition to the best-in-class 1700 V EconoDUAL 3 with 900 A, a 750 A module with a larger diode has also been introduced to further increase the flexibility of the new portfolio. Overall, the new EconoDUAL 3 1700 V modules with the TRENCHSTOP IGBT 7 chip can increase the power density of the inverter and achieve a new level of performance in a wide range of applications.
The FF900R17ME7_B11, FF750R17ME7D_B11 and FF225R17ME7_B11 can be ordered now. The roll-out of the portfolio, specifically the current classes from 300 A to 750 A, will follow at the end of 2022.
During PCIM 2022, a paper presentation will be held on 10 th of May by Aleksei Gurvich, senior manager of product definition & application engineering, about the new 900 A and 750 A 1700 V EconoDUAL 3 Modules with TRENCHSTOP IGBT7.