Power Integrations at PCIM Europe

Infineon introduces new synchronous buck regulators

Flex Power launches 16-160V DC-DCs

Renesas driver family enables torque at zero speed

Rohm adds SiC and IGBT models to SPICE library

Wolfspeed completes sale of RF business to Macom

TI expands low-power GaN portfolio

EET uses EPC GaN FET in balcony solar product

Coherent’s SiC business completes $1B investment

ST extends MasterGaN performance

Change of CEO at Clas-SiC fab

Transphorm releases new charger designs

SIPLACE TX micron from ASMPT combines SMT assembly and die processing

Spirox and Southport announce SiC defect tool

Nexperia releases first SiC MOSFETs

$1.2M NSF award to test power grid stability

Infineon introduces 15V trench power MOSFETs in PQFN

Diamond device has highest breakdown voltage

Würth Elektronik extends its terminal block connector series

EU project paves way for improved grid resilience

DOE announces $42M to update US power grid

New 650V CoolMOS option targets fast EV charging

Toshiba launches first 30V N-channel common-drain MOSFET

Onsemi opens European EV systems lab

Infineon adds 62mm package to CoolSiC portfolio

Legrand chooses Innoscience GaN chips

Transphorm and Allegro partner on GaN driver solution

QPT shortlisted for ABB power density challenge

Microchip Releases Its Latest TrustAnchor Security IC

Infineon revenue and profits up

Heraeus acquires stake in start-up Zadient

OKI develops GaN lift off/bonding technology

Odyssey is meeting key milestones, says CEO