Soitec to expand manufacturing footprint
New Bernin fab will produce high volume SmartSiC wafers for EVs and industrial markets and increase SOI capabilities
Soitec has announced today a new fabrication facility at its headquarters in Bernin, France, primarily to manufacture new SiC wafers which respond to key challenges of the electric vehicle and industrial markets. The extension will also support Soitec’s 300-mm Silicon-on-Insulator (SOI) activities.
The factory is to produce innovative SmartSiC engineered wafers developed by Soitec at the Substrate Innovation Center located at CEA-Leti in Grenoble, using Soitec’s proprietary SmartCut technology.
Soitec says this new generation of SiC wafers adds significant value for industrial applications and electric vehicles. It allows to enlarge their driving range, shorten the charging time and diminish their cost. With its SmartSiC products, Soitec is engaged with major SiC device makers and targets to generate first revenues in the second half of calendar year 2023.
"We expect that by 2030, around 40 percent of all new cars will be electric. Our unique, highly performant, sustainable and cost competitive SmartSiC solution addresses the industrial challenges, helps to optimise energy efficiency, and will accelerate the adoption of electric vehicles," says Paul Boudre, Soitec CEO. "This investment is a major milestone for us as SmartSiC is set to be another growth engine for Soitec, and a driver of the transformation of the automotive and industrial markets."
