News Article

ACM Research Enters Bevel Etch Market To Support Emerging Process Steps


ACM Research, Inc.,
a supplier of wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, announced the launch of its Bevel
Etch product, which further expands ACM's comprehensive offering of
wet tools. The new product uses a wet
etch method to remove various types of dielectric, metal and organic material
films, as well as particulate contaminants on the wafer edge. This approach
minimizes the impact of edge contamination for subsequent process steps, and
improves chip manufacturing yield.

“During the
chip manufacturing process, wafer edge peeling, particles and residue result in
wafer edge yield loss, especially for 3D NAND, DRAM and advanced logic
processes,” said David Wang, CEO of ACM Research. “We developed the ACM Bevel
Etch product to reduce yield loss at the edge, which is becoming increasingly
important to optimize overall process yields. This new product leverages ACM's
extensive wet processing expertise to deliver significant performance benefits
compared to dry approaches, and consumes significantly reduced amounts of
chemicals. In addition, with ACM's proprietary technology, it can achieve more
accurate and efficient wafer center alignment, which can enable it to deliver
precise bevel etch that will enhance product yields
and wafer

ACM's Bevel Etch product supports a range of device types and process
steps for 3D NAND etch, DRAM and advanced logic processes.

manufacturers have used a dry bevel etch process to address edge film and
contamination removal. The wet etch approach avoids the arcing and silicon
damage risk from the dry process, while also offering variable wafer bevel
etch/cut accuracy of 1-7mm, good uniformity
of +/-0.1mm, controllable etch selectivity and
low chemical consumption, for a lower total cost of ownership.

ACM's Bevel
Etch product first tool for high volume manufacturing is expected to be
delivered to a Chinese logic manufacturer in the third quarter of 2021.

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