Info
Info
News Article

Extension Of The New Y-RED Test Contactor Generation

News

The Y-RED test contactor series from Yamaichi Electronics is growing. In addition to IC chip evaluation and validation, the focus is now on failure analysis applications and low inductance laboratory measurements.

With decades of experience in designing full and semi-custom test contactors, the Y-RED combines high-grade technology and standardised single parts with simplified, user-friendly mounting procedure.

As the first product of the new generation Y-RED, the standard hinged test contactor for component qualification applications was released at the end of 2019. Now, several extensions of this product series will follow at once.

The Y-RED Failure Analysis

While the already available Y-RED is mainly used in the evaluation and validation (EV) of IC chips, the new Y-RED test contactor specialises in the sensory failure analysis (FA). Through an opening in the lid, the entire component is now visible during testing. An inlaid scratch and crack-resistant glass plate with a very wide transmission curve ensures uniform pressure distribution during contacting. These are features to perform chip analysis with Solid Immersion Lens and Emission Microscopy.

Extended size variety

For DUT package sizes between 1.5 mm x 1.5 mm and 5 mm x 5 mm, a smaller version is also available for both the Y-RED EV and the new FA test contactor. The more compact design of the test contactor not only saves space on the evaluation board/PCB, but also brings the measurement closer to the component. The pitch already starts at 0.3 mm, the application temperature range is specified from -40°C to +150°C. For dimensions larger than 5 mm x 5 mm up to a maximum of 12 mm x 12 mm the large form factor Y-RED is used.

Like the other Y-RED test contactors, also the smaller version is designed for LGAs, QFNs as well as BGAs / (WL)CSPs.

Low-Inductance Probe Pin

A low-inductance pin is also available for laboratory measurements with particularly low inductance requirements. It can be incorporated into all the test contactors presented. This can be installed in all the Test Contactors presented. Whereby the achievable high performance can be used in diverse areas of application, and the various advantages can be optimally combined.

With a contact height of only 2.80 mm, a self-inductance of less than 0.80 mm is achieved. A pitch between 0.3mm and 0.5mm is provided. The application temperature range covers -40°C to +125°C.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face on 9-10 November 2021

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register

Melexis Announces Latest Triaxis Position Sensor Together With New PCB-less Packages
GeneSiC Announces 5th Gen 650V SiC Diodes
Ultra High Density Offline Power Solutions From ON Semi
Zollner Opts For New 3D AXI Generation IX7059 From Viscom
Toshiba Expands Scope Of Its Solid-State LiDAR Solution To Address Transportation Infrastructure Monitoring
ROHM’s High 8V Gate Withstand Voltage Marking Technology Breakthrough
Cost-Efficient, Regulated SIP8 DC/DC Converters
Menlo Micro Launches Industry’s First 40 Gbps DPDT Differential Switch
Chokes From SMP For Medical Technology Applications
Pfeiffer Vacuum Is A Partner Of The Kems4Bats Junior Research Group Of The German Federal Ministry Of Education And Research
Hitachi ABB Power Grids Announces Sustainability 2030
Low RDS(on) 40 V MOSFETs From Nexperia Deliver Highest Power Density
ON Semi Announces SiC MOSFET Modules For Charging EVs
GeneSiC Announces 3rd Gen 750V SiC MOSFETs
APEC 2022 Call For Technical Paper Digest Submissions
Efficient Power Conversion Announces New Family Of Radiation-Hardened Enhancement-Mode Gallium Nitride (eGaN) Transistors
PCB Depaneling: Laser Technology Improves Quality And Efficiency For Automotive Applications
Schneider Electric Unleashes EcoStruxure Power To Deliver Reliable “always-on” Electrical Power
Navitas 'Electrify Our World' At APEC 2021
Yokogawa Launches New AC Energy Calibration Service
Renesas Expands Portfolio Of World’s Smallest Photocouplers
Rohm Announces AC/DC Converters With Built-In 1700V SiC MOSFET
New High Current Variable Test Power Supplies
Construction Begins On First-of-its-kind Electric Vehicle Battery Technology Centre And Pilot Line

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event