Info
Info
News Article

ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology

News

Proven MTP technology enables massively-parallel pick-and-place of large arrays of ultra-thin chips, bringing new heterogeneous integration capabilities for 3D ICs

ASM AMICRA Microtechnologies GmbH, a subsidiary of ASM Pacific Technology Limited, announced three new manufacturing systems that combine X-Celeprint's Micro-Transfer Printing (MTP) and ASM AMICRA's high precision die bonding technology to introduce the semiconductor industry's first complete system to enable high volume heterogeneous integration of ultra-thin dies onto up to 300mm base wafers.

X-Celeprint's MTP process stacks ultra-thin dies known as ‘x-chips', which can be extremely varied and made using very different process nodes and technologies, to create virtually monolithic 3D ICs that improve power, performance, area, cost, time-to-market and security for a wide array of applications including high-performance computing, communications, mobile, automotive, industrial, medical, or defense systems.

ASM AMICRA has been perfecting ultra-high precision placement technology for almost 20 years, and has now incorporated X-Celeprint's MTP technology into three different manufacturing systems. These are:

    • • The Nova+ MTP system, which serves high throughput needs with a fully automatic ISO 4 clean room class system using a 50x50mm MTP stamp enabling massively parallel
    • pick-and-place of x-chips. Placement accuracy is +/- 1.5-microns with a 40-second cycle time.
    • • The NANO MTP system, which serves markets such as photonics that require more precise placement accuracy (plus-or-minus 0.3-microns).
    • • The AFC+ MTP system, which serves R&D and low volume manufacturing markets. Placement accuracy is plus-or-minus 1.0-microns with a 50-second cycle time.>/li>

X-Celeprint and ASM AMICRA are facilitating the adoption of MTP technology through development support, including design consultation with assistance in optimizing design and processes and prototyping services to ensure successful product launches. An extensive network of suppliers, manufacturers, and researchers are available to support customer project needs, including licensing programs.

“This agreement with X-Celeprint brings revolutionary technology to market for photonics and 3D heterogeneous integration,” said Dr. Johann Weinhändler, Managing Director, ASM AMICRA Microtechnologies GmbH. “MTP technology offers efficient handling of high volumes of large arrays of ultra-thin, brittle dies, as well as the ability to integrate dies from several different source wafers. MTP technology will provide semiconductor manufacturers with a critical, additional ‘tool in the toolbox' that supplements conventional and advanced packaging technology.”

“The ultra-high precision capabilities of ASM AMICRA's MTP manufacturing systems for heterogeneous integration of large arrays of ultra-thin x-chips has the potential to be a game-changer for semiconductor manufacturers seeking to extend Moore's Law with 3D IC heterogeneous integration,” said Kyle Benkendorfer, X-Celeprint's CEO. “Enabling chip designers to combine the optimum materials and different process technologies in 3D ICs results in more powerful devices, with higher density, increased functionality, lower cost, higher yield, and faster time to market.”

SEMIKRON And Silicon Mobility Announce Collaboration
UK To Establish Supply Chain For SiC And GaN Trench Devices
Pre-Switch Publishes Highest Efficiency Figures For 200kW Inverter
Nexperia’s 650 V GaN FETs Enable 80 PLUS Titanium-class Power Supplies
Mitsubishi Electric To Launch New X-Series HVIGBTs And HVDIODEs
Henkel 3D Printing Facility Drives Sustainability By Achieving Zero Waste To Landfill Status
Infineon Launches New 1200V CoolSiC MOSFET
ASM AMICRA Unveils Industry’s First Manufacturing Systems Incorporating X-Celeprint’s MTP Technology
Open Source Power Delivery Software Enables Code Integration For USB System Differentiation
CISSOID Expands SiC Power Module Range
II-VI Expands SiC Manufacturing In China
EPC To Show Latest EGaN FETs At PCIM Europe 2021
Power Integrations’ HiperPFS-4 Power Factor Correction IC Delivers 98% Full-Load Efficiency
World-leading Circular Solution For Charging Of Vehicles Inaugurated
STMicro Introduces New MasterGaN4 Devices
Nexperia Announces New ESD Protection Devices For High-speed Interfaces In Automotive Applications
New Drag And Drop Graphical User Interface For Ultra-fast Sensor Data Analytics
Powerful IX7059 Heavy Duty Inspection System From Viscom Wins NPI Award
SSE Renewables Chooses SEANEX Connection System For Seagreen Offshore Wind Farm Project
Keysight Announces GaN Test Board For Power Analyser
MKS Instruments Powers Its Way To Market Share Gains In 2020
Infineon To Present At Virtual Power Conference
EasyPACK CoolSiC MOSFET Module Supports Fast-switching DC-link Voltage Of 1500 V
X-FAB Enhances Automotive Embedded Flash Offering

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event