Viscom Introduces New 3D AXI And 3D AOI Innovations At This Year's Virtual IPC APEX
This year's IPC APEX EXPO 2021 will be held virtually from March 8 - 12, 2021 due to the pandemic. The online event platform is nevertheless designed to meet visitors' expectations and promises the usual showcases of the latest technologies as well as exchanges with the experts in more than 100 technical conferences, live product demonstrations and one-to-one meetings. Viscom Inc. will also be there, using the digital platform of IPC APEX to present several innovations for the first time. Viscom is introducing new systems to the market in all solution areas, such as 3D SPI, 3D AOI, 3D AXI, 3D Bond and CCI, which offer even faster, versatile and, above all, highly precise inspection of electronic assemblies, wire bonds and protective coatings. As a highlight, the new system generation iX7059 celebrates its premiere and is first shown in a live demo.
Unlimited possibilities and the most stringent quality assurance are offered by the new inline X-ray system iX7059 PCB Inspection XL for high-end electronics production. At the heart of the new 3D AXI system is CT-based 3D X-ray technology which provides high-speed and high-quality imaging.
The new iX7059 Heavy Duty Inspection X-ray system is also part of Viscom's brand-new iX7059 series for fast, fully automated inline X-ray inspection. Viscom has developed a special transport system for the handling of workpiece carriers and soldering frames to ensure that heavy and encased assemblies can be transported and inspected in optimized cycle times. This special system can transport assemblies with dimensions of up to 500 mm x 500 mm and a weight of up to 40 kg. As a result, fully automated X-ray inspection is gaining a foothold in new sectors such as electric vehicles, network infrastructure for the telecommunications 5G standard and in the area of renewable energies
To prevent errors from the very beginning of the SMT process, the use of a 3D SPI system in the SMT line is indispensable. Viscom's new S3088 ultra chrome system provides outstanding 3D solder paste inspection by combining compact design, fastest handling and best inspection quality for high-throughput, defect-free electronics manufacturing. A newly developed sensor system based on advanced XM camera technology is used. The combination of 10 μm resolution and four angled views provides shadow-free images to reliably detect the smallest inspection areas. At the same time, the uniquely large inspection area also covers heights up to 4 mm for very high paste deposits. The new 3D SPI from Viscom is also available as a dual lane system. Intelligent networking of 3D SPI, 3D AOI, 3D AXI and verification station ensures maximum quality and process efficiency.
Viscom is introducing a new 3D wire bond inspection system which provides additional height information. Bond wires with a diameter of less than 25 µm can be measured in three dimensions - the actual height of the loops is an important test property in addition to the shape. Also the standard algorithms of wire bond inspection allow an excellent safeguarding of wire bonded circuits against defect.
The S3088 CCI comes with an unmatched upper transport clearance the system also provides layer thickness measurement. The system quickly and reliably detects typical defects such as cracks, coating voids, smearing and splashing. With the 3D spot measurement option The inspection process uses white light and special UV LEDs which reliably reveal defects in UV-sensitive conformal coating. Optimal inspection coverage is ensured by means of one orthogonal camera in combination with four, or optional eight, angled view cameras, which allow for accurate inspection of component sides and gaps between pins. Viscom's new S3088 CCI inspection system ensures high-precision conformal coating inspection of printed circuit boards.
of 105 mm. Thus the CCI system provides even more flexibility during final inspection of fully assembled components wherever electronic components need to be protected against damaging environmental influences.