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Heraeus Launches New Bonding Ribbon For SiC Modules

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PowerCuSoft copper bonding ribbon enables SiC power modules to be designed and manufactured more reliably, efficiently and cost-effectively

Heraeus has announced a copper bonding ribbon called PowerCuSoft Ribbon that it has optimised for surface contacting on SiC semiconductors.

Copper offers better thermal, electrical and mechanical properties compared to aluminium wire and ribbons. The material heats up less than aluminium and can withstand higher module temperatures - this improves the lifespan and reliability of power modules, according to the company.

PowerCuSoft Ribbon can withstand module temperatures of up to 250degC. In tests, copper ribbons show a ten to twenty times longer service life than comparable products made of aluminium, while at the same time increasing the energy density in the module.

"SiC semiconductors are in the fast lane due to their high power density," says Christian Kersting, product manager power bonding wires at Heraeus Electronics. "In order to be able to use the advantages of these products, module manufacturers need high-performance packaging and interconnection technologies.”

Compared to copper wires, ribbons also offer cost advantages, as one ribbon replaces several copper wires. Manufacturers are thus able to optimise the manufacturing costs per module as output increases. Depending on the module design, even twice the number of modules per hour can be produced.

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