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SST Vacuum Reflow Systems Launches Automated Vacuum Pressure Soldering System

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Palomar Technologies, a provider of process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate - a key to delivering high-reliability power modules for automotive and commercial applications.

A.J. Wilson, President of SST Vacuum Reflow Systems and CMO for Palomar Technologies commented, “The electric vehicle market is exploding and one key to the successful rollout is mass availability of affordable and reliable power modules. In addition to higher volumes, power modules are expected to be more efficient and to be able to operate under more stressful conditions, such as higher temperatures and more power cycles. Our new automated vacuum pressure soldering system succeeds in providing both high volume and high reliability for the assembly of power modules.”

The SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST's unique system of applying both vacuum and gas pressure to achieve an extremely low void ratio for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering. The power module market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life. Other industry segments with a demand for highly reliable power modules include power converters for wind turbines, photovoltaic solar energy systems, and other renewable energy applications, as well as industrial motor controls and large scale medical devices. Specific applications include: IGBT/SiC/GaAs/GaN die attach, CPV solar cell assembly, die attach for pressure sensors, hermetic sealing of high-reliability packages, high intensity LED attach, hermetic sealing of IR image sensors, copper clip soldering, high power laser module assembly, and multilayer ceramic capacitors.


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