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Cree Selected As SiC Partner For Volkswagen

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FAST Program partnership aims to accelerate market transition to electric vehicles

Cree has been chosen as the exclusive SiC MOSFET partner for the Volkswagen Group's 'Future Automotive Supply Tracks' Initiative (FAST). The aim of FAST is to work together to implement technical innovations quicker than before and to realise vehicle projects even more efficiently and effectively.

“The Volkswagen Group has committed to launch almost 70 new electric models in the next ten years, which is up from our pledge of 50 and increases the projected number of vehicles to be built on the Group's electric platforms from 15 million to 22 million in that timeframe. An effective network is our key to success. Our FAST partners are our strategic partners, each of them outstanding in their respective field. We want to shape the automotive future together.” said Michael Baecker, head of Volkswagen purchasing connectivity.

This agreement connects the automotive industry's move from internal combustion engines to EVs and the growing adoption of SiC in the semiconductor market. It also drives innovation for both parties, enabling the Volkswagen Group to better serve their customers.

The use of SiC accelerates the automotive industry's transformation to electric vehicles, enabling greater system efficiencies that result in electric cars with longer range and faster charging, while reducing cost, lowering weight and conserving space.

“Cree's technology is at the heart of the dramatic change underway in EVs, and we are committed to supporting the automotive industry as it transitions to more efficient, higher performing SiC-based solutions,” said Gregg Lowe, CEO of Cree. “We are very honoured to be partnering with the Volkswagen Group. VW Group is a global power in the automotive field with a strong commitment to electric vehicles, and this partnership will leverage the advantages of SiC to enable longer driving distances, shorter charge times and improved efficiency. We look forward to helping them deliver on the automobiles of the future.”

The Volkswagen Group and Cree will be working with tier one and power module suppliers to engineer SiC-based solutions for future Volkswagen Group vehicles. The partnership was announced on May 10. This follows Cree's May 7 announcement of its significant manufacturing capacity expansion of SiC MOSFETs and wafers in support of its customers.

Picture above shows Cree CEO, Gregg Lowe with Michael Baecker, head of Volkswagen purchasing connectivity

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