News Article

A Safer Supply Chain With Vincotech’s Multi-sourced Offering

Vincotech has reiterated the benefits of its practice of sourcing semiconductors from several vendors. This supplier of module-based solutions for power electronics pointed out that its multiple sourcing strategy goes to protect customers' business interests by mitigating risks in the supply chain. Vincotech has qualified all leading manufacturers under an open and flexible vendor policy. This also gives customers the freedom of choice and flexibility to choose the chipset - that is, the combination of IGBT and diode - that best fits the application and its unique requirements. Customers enjoy the benefits of a power module that strikes the best balance of price and performance for industrial and embedded drives and solar, energy storage and EV charger applications.

A simulation tool serves to optimize the switching pair. It draws on a database that holds all the characterization information for each component. This bar chart, for example, shows a comparison of loss breakdown and module cost for various diodes paired with a high-speed IGBT in a motor drive sixpack operating at 16 kHz. In this example, a high-speed IGBT paired with tandem diodes achieves the best/performance ratio.

Speedier Switching with Vincotech's New Tandem Solution A unique family of high-speed power modules is now available to boost efficiency and strike the best balance between 2019costs and benefits. Freshly launched by Vincotech, a supplier of module-based solutions for power electronics, the new flowPACK 1 1200 V sixpack features tandem diode technology and a high-speed IGBT.

This new product line extends the company's portfolio of power modules for motion control applications requiring higher switching frequencies and lower power loss. This family of high-speed 1200 V sixpacks with tandem diodes is comprised of several IGBT modules to cover currents ranging up to 75 A at room temperature. Its unique feature set ups current control capability and efficiency to slash overall system costs. All products ship in a flow 1 package with Press-fit pins. Every package shares the same pin-out and footprint, so drive manufacturers can easily re-use the same PCB design for various power applications.

To learn more about Vincotech's flowPACK 1 1200 V, please visit

Stepping Up Power Density with Vincotech's New PFC Module

Vincotech has extended its product line-up with the flow3xANPFC 1, a new PFC module aimed to help vendors step up efficiency and drive down costs. Vincotech, a supplier of module-based solutions for power electronics, engineered this ultra-compact module to pack a lot of power into a petit housing. Offering impressive performance at a remarkably low price, the flow3xANPFC 1 line goes a long way towards cutting manufacturers' overall system costs.

These modules feature unique PFC topology for three-phase applications that deliver up to 10 kW. They come with the latest IGBT technology and either ultra-fast Si diodes for cost and efficiency benefits or SiC diodes for higher switching frequencies. Integrated NTCs monitor the temperature; built-in snubbing capacitors reduce EMI and mitigate voltage over-shoot.

flow3xANPFC 1 modules ship in compact, low-inductive flow 1 housings that are 12 mm in height. Press-fit pins and phase-change material make assembly so much easier, with the latter also improving thermal performance. Both are available upon request.

To learn more about the flow3xANPFC 1 modules, please visit

To learn more about the flowPACK 1 with tandem diodes, please visit For alternatives, see


Vincotech GmbH has announced it
has extended the power range of its flow E1/E2 product family. Featuring
the latest IGBT M7 chip technology, these modules come in PIM (CIB) and sixpack
configurations for 25 A, 50 A and 100 A.

Vincotech, a supplier of
module-based solutions for power electronics, already offers the industry's
broadest portfolio of standard products. This expansive range just got bigger
with the new flow E1/E2 modules for motion control applications. These
packages feature a 12 mm-high low inductive housing with two lateral mounting
screws, Press-fit pins or solder pins, and no baseplate. The housing's footprint
and pin-out are fully compatible with standard industry packages. Customers can
use the same heat sink and a printed circuit board (PCB) with identical

Vincotech engineers optimized the
design of flow E1/E2 housings to provide an excellent mechanical contact
to the heat sink and achieve superior thermal performance with 15% lower Rth
than competing products. These modules also shoehorn higher power density into
a smaller package. With multiple sources available for all hardware and
electronics, this new product line affords customers greater freedom of choice
and helps mitigate supply chain risks.

To learn more about Vincotech's flow
E1/E2 products, please visit

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