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Tuesday 27th May 2014
The silicon carbide (SiC) devices aim to improve hybrid vehicle fuel efficiency by 10 percent and reduce PCU size by 80 percent compared to current silicon-only PCUs
Tuesday 27th May 2014
The high performance and compact SPM devices are suited for use in power motors under 100W
Tuesday 27th May 2014
The mutual decision sees CFO Wolfgang Breme leaving the group
Tuesday 27th May 2014
The wafers will be used for the RF and power semiconductor markets
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Friday 16th May 2014
All-SiC 300A, 1.2kV half-bridge module doubles power density and increased efficiencies 

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