Friday 19th July 2019
Compared with traditional 3-level neutral-point-clamped topologies, the
advanced neutral-point-clamped (ANPC) inverter design supports an even
loss distribution between semiconductor devices.
Thursday 18th July 2019
The adoption of SiC power devices is now undeniable. The power electronics industry has no more questions about it. Today, questionings are more related to the companies and the playground: how and when they will make it…
Tuesday 16th July 2019
Tuesday 16th July 2019
Wideband semiconductors poised to grow at a 60% CAGR through 2026
Thursday 11th July 2019
Tuesday 9th July 2019
Tuesday 9th July 2019
Establishes volume production of SiC power diodes and MOSFETs
Tuesday 9th July 2019
Tuesday 9th July 2019
Tuesday 9th July 2019
Increase in on-street parking facilities will also be
crucial says Justin Meyer
Monday 8th July 2019
Thursday 4th July 2019
Thursday 4th July 2019
Efficiency is driving the adoption of SiC and GaN technologies
Thursday 4th July 2019
Figure 1: Prius PHV demo model equipped with solar battery panel
Wednesday 3rd July 2019
Imec and UTAC co-developed a unique process for wafer thinning and backside metallization of highly stressed GaN-on-200 mm silicon wafers that enables a packaged 650V GaN device smaller than other ‘state-of-the-art’ approaches. By: Stefaan Decoutere and Nicolo Ronchi, imec
Wednesday 3rd July 2019
Predicts widespread automotive adoption of SIC technology in early 2020s
Monday 1st July 2019
Friday 28th June 2019
IDTechEx Research says that higher power densities mean we will see the growing use of sintered metal pastes
Wednesday 26th June 2019
New generation III GaN-on-Si FETs designed for powering three-phase broad industrial power supplies and automotive converters
Wednesday 26th June 2019
Wednesday 26th June 2019
Tuesday 25th June 2019
Tuesday 25th June 2019
