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Tuesday 22nd October 2019
Monday 21st October 2019
Packaging market for power modules will be worth $2.2 billion by 2024
Monday 14th October 2019
Please join Dave Skinner Product Marketing Manager22 October 2019, 2pm Eastern, 11am Pacific
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Friday 11th October 2019
In the SiC Modul project, the power semiconductor is now to be put on the road to industrial production.
Thursday 10th October 2019
Using SiC will address one of the key stumbling blocks for potential buyers of electric cars
Wednesday 9th October 2019
Why Cree has shifted SiC wafer expansion plans from North Carolina to New York state, reports Rebecca Pool.
Wednesday 9th October 2019
Up to 35 percent lower switching loss over conventional packages reduces device power consumption
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Tuesday 8th October 2019
Tuesday 1st October 2019
Covers GaN theory and applications, such as lidar, DC-DC conversion, and wireless power
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Monday 23rd September 2019
Company to build automotive-qualified 200mm power and RF wafer fabrication facility in Marcy, New York

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