Monday 19th May 2014
Monday 19th May 2014
Friday 16th May 2014
Friday 16th May 2014
All-SiC 300A, 1.2kV half-bridge module doubles power density and increased efficiencies
Friday 16th May 2014
Thursday 15th May 2014
Thursday 15th May 2014
Thursday 15th May 2014
Monday 12th May 2014
Monday 12th May 2014
Three new tiers of manufacturing quality substrates to optimize next-generation power electronic device designs
Friday 9th May 2014
The aggregate purchase price has been increased to $300 million
Friday 9th May 2014
The film combines high glass transition temperature and stress absorption with thermal performance in dieâ€attach power dissipation
Thursday 8th May 2014
The gallium nitride devices are designed to support data-hungry small cell networks
Thursday 8th May 2014
Wednesday 7th May 2014
The firms will work together to develop high volume production processes and equipment necessary to bond the ultra-thin sapphire and SiC lamina to engineered substrates such as glass, silicon, and plastics
Wednesday 7th May 2014
Maheshwari brings more than twenty years of experience in engineering and finance to Veeco
Wednesday 7th May 2014
The high efficiency 48 V output model supports gallium nitride power amplifier systems
Wednesday 7th May 2014
Tuesday 6th May 2014
Odakyu's 1000 series urban train to achieve dramatic lower energy and remodeling costs with silicon carbide technology
Saturday 3rd May 2014
Saturday 3rd May 2014
Friday 2nd May 2014
The firm will use Keragis' GaN and GaAs technology for power amplifiers
Friday 2nd May 2014
The firm's tool characterises power device parameters, such as RDSON , Leakage, Ciss, Coss, Crss and gate charge
Friday 2nd May 2014
