Dow Corning to Highlight Advanced Materials Solutions at PCIM Europe
Two technical experts from Dow Corning Corporation will speak at PCIM Europe 2016, scheduled to run in Nuremburg, Germany from May 10 to 12. The company, co-exhibiting with its German distributor Biesterfeld Spezialchemie, will also spotlight at Booth #519 in Hall 7 its broad and growing portfolio of advanced silicones for thermal management, protection and assembly of electronic modules, as well as its silicon carbide (SiC) wafer products for power device fabrication.
"As a leading global supplier of both silicone and silicon carbide technology, Dow Corning is uniquely positioned to help module makers create more efficient, reliable and cost-effective power electronic devices," said Craig Bromley, European marketing manager, Electronics at Dow Corning. "Combined with our 70-year history of collaborative innovation with industry leaders, we are committed to helping customers along the entire electronics value chain to enhance the productivity, performance and reliability of power electronic products targeting advanced applications in transportation, industry and energy."
Eric Vanlathem and Thomas Seldrum "“ Dow Corning application engineers "“ will present posters highlighting high-performance silicone solutions aimed at driving advances in power electronics. Titles and details of each poster include:
"¢ New Silicone Gel Enabling High Temperature Stability for Next Generation Power Modules, will detail and validate the performance of a silicone gel encapsulant that retains its flexibility, dielectric strength and adhesion to substrates after several thousands of hours of aging at 225°C.
"¢ Low Stress Silicone Encapsulant Enables Distributed Power Generation," describes how Dow Corning EE-3200 Low-Stress Silicone Encapsulant helps to minimize stress on power electronic components during thermal cycling, thereby helping to enhance the reliability, durability and lifetime of advanced conversion devices for distributed power generation.
The Dow Corning/Biesterfeld booth will showcase a very broad portfolio of silicone and SiC solutions for optimizing the performance, efficiency and reliability of power electronic modules. In addition to the low-stress EE-3200 gel featured during the poster session, Dow Corning will highlight other ground-breaking product technologies, including:
"¢ The new and recently launched Thermal Radical Cure technology, Dow Corning EA-7100 Adhesive, which cures rapidly and at lower temperatures from the "inside out" to greatly accelerate processing, lower energy use and reduce material costs. This advanced adhesive can form strong bonds to a broad range of materials including traditionally challenging substrates such as polyethylene, polycarbonate and acetal without requiring pre-treatment or extensive cleaning.
"¢ High-heat resistant solutions, such as Dow Corning EG-3896 and Dow Corning EG-3810 Dielectric Gels target power modules rated at 175°C. These advanced encapsulant materials withstand higher junction temperatures, allowing for higher power densities that, in turn, enable development of smaller modules.
"¢ Thermal management solutions, such as Dow Corning TC-4525 Thermally Conductive Gap Filler delivers thermal conductivity of 2.5 W/mK, greatly improved dispensability, significantly reduced abrasiveness and stable performance for more reliable electronics in harsh automotive underhood environments.
A further highlight at the booth will be Dow Corning's portfolio of high-quality 4H n+ SiC solutions for power electronics applications. The company offers three tiers of manufacturing quality SiC substrates available as 100- or 150-mm-diameter wafers (bare) and with SiC epitaxial layers (n- or p-type). Labeled Prime Standard, Prime Select and Prime Ultra, each wafer tier offers progressively more stringent tolerances on critical defect types that adversely impact device performance.
