Lux identifies strategies for success with GaN and SiC Power electronics
Carmakers can succeed by playing the role of "˜integrator' while chip developers must be "˜technology disruptors'
Power electronics based on GaN and SiC have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.
Carmakers can succeed by playing the role of an "˜integrator' by vertically integrating upstream in the value chain to power modules, while a GaN or SiC developer would do well to pursue a "˜technology disruptor' strategy, offering core technology expertise to solar inverter makers and incumbent system integrators like ABB.
"Fast-growing markets like automotive and solar inverters are unforgiving when it comes to players without strong business and strategy," said Pallavi Madakasira, Lux Research Analyst and the lead author of the report titled, "˜Strategic Playbook for Power Electronics: Lessons from the IC Sector Evolution'.
"Start-ups trying to address these opportunities need to forge partnerships and collaborations - companies like Transphorm and GaN Systems that have done so are best-positioned for success," she added.
Lux Research analysts evaluated the value chain in GaN and SiC power electronics to identify strategies for the automotive and solar inverter market and came up with various findings.
One is that integrators face low risk. Carmakers could integrate upstream through acquisition to include power modules and inverter/converter manufacturing. Such acquisitions will allow carmakers to own drivetrain design and lower overall costs.
Tech differentiation is also critical. A vertically integrated GaN/SiC device or module player is well-positioned in the solar value chain. The core technology differentiation that such a company offers will be critical for incumbent solar inverter makers like SMA and Fronius, and something system integrators like ABB do not have the competencies for.
Finally, other players need to be nimble. Suppliers of substrates, packaging materials and thermal materials will need to customize. Staying nimble and planning for an increased number of specialised device makers in the power electronics value chain will be critical to their overall success.
