News Article

CSC Announces Partnership In £9.8m SiC Project


ESCAPE project will create end-to-end supply chain for next generation automotive SiC power electronics

The Compound Semiconductor Centre is a partner in a project which has been awarded £9.8m in funding through the UK's Advanced Propulsion Centre (APC).

The ESCAPE project (End-to-end Supply Chain development for Automotive Power Electronics) will create a complete end-to-end supply chain for next generation SiC Power Electronics, which is a key component to be used in all electric vehicles, whether automotive, railway, marine or aviation - a first for the UK.

This funding is part of the UK government's £33 million investment through APC to advance the UK's low-carbon automotive capability and to develop the next generation of low-carbon vehicles, helping the automotive sector build a prosperous low-carbon future. The ESCAPE project, let by McLaren Applied Technologies, is one of five projects awarded funding, ranging from the development of high-performance battery packs and electrified construction equipment, to hydrogen powered engines.

Twelve other partners will support the creation of the integrated supply chain, including other industry leaders such as AESIN, Clas-Sic Wafer Fab, the Compound Semiconductor Applications Catapult, Exawatt, Lyra Electronics, MaxPower Semiconductor, Tribus-D, Turbo Power Systems and The University of Warwick.

Wyn Meredith, CSC director commented: “The demand for SiC power components is growing rapidly, and we welcome the opportunity to work with our partners to ensure the UK has a world class future supply chain in this critical technology ”.

Oxford Instruments Launches ALD Manufacturing Solution For GaN Power Device Passivation
Scatec Solar Reaches Financial Close For 55 MW Project In Ukraine
Lidl To Invest €1m In Ireland’s Largest Ever Installation Of Solar Panels
GaN And SiC Power Semis Worth $3 Billion By 2025
Q CELLS Offers Businesses Direct Marketing Of Solar Power In Germany
Loughborough Expert Helps Construct New United Nations Specifications
Fraunhofer IAF Enhances Functionality Of GaN Power ICs With Integrated Sensors
Ascatron Secures €3.5 Million For SiC Product Development
ABB Helps Build A Brighter Future For Costa Rica With High Power Inverter Technology
ROHM Power Supply Monitoring IC With Built-In Self-Diagnostic Function
GaN And SiC Require A New Approach To Packaging
Sanan IC Expands Wafer Foundry Portfolio With 150 Mm GaN-on-silicon Process
Packaging Solution For GaN On Silicon Power Devices
MagnaChip Introduces New Component To Enhance 5G/LTE Smartphone Battery Life
China, India, Japan And South Korea Set To Surpass 1 Billion Installed Smart Electricity Meters In 2025
EV Group Earns Seventh Triple Crown Win In Customer Satisfaction Survey
ABB To Exit Solar Inverter Business
SiC And GaN-based Power Electronics To Boost Automotive Semiconductor Efficiencies And Profitability
Transphorm Adds Second FET To 900V GaN Range
Amtech COO Talks About Growing SiC Opportunities
Navitas Earns Innovation Award For GaNFast Power ICs
Technology And Smarter Charging Solutions Key To Mass Adoption Of EV
NEDO, Sharp, And Toyota Trials Electrified Vehicles Equipped With Solar Batteries
Power Electronics For The Energy Transformation

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: